The market for non-UV dicing tapes is expected to expand during the projected period due to the rising demand from the semiconductor industry. In order to better concentrate on customer demand during these challenging times, semiconductor businesses continue to structure on end markets rather than products. The essential semiconductor product areas are largely unchanged from the study from the previous year, with the exception of the number two position, where microprocessors have surpassed analog/RF/mixed-signal. Sensors and MEMS are the top growth market, according to poll respondents, with interest being stoked by the rise in Internet of Things (IoT) applications, smartphone and wearable technology demand, and the automotive industry.
Non-UV dicing tapes market size was $1.59 billion in 2022, and is anticipated to grow to a value of more than $2.13 billion by 2030, with a growing CAGR (compound annual growth rate) of over 6% from 2022 to 2030.
The microprocessors segment is anticipated to remain an industry priority in sales and innovation, notably for auto entertainment and driver-assist systems, given the ever-increasing performance demands on customers' minds. Non-UV Dicing Tapes Market assist in holding the semiconductor wafer with a ring frame during the dicing process and safeguard the semiconductor wafer's surface during the back-grinding process. Thus, it is anticipated that throughout the projected period, the growing semiconductor sector will aid in the expansion of the market. In addition, the market is anticipated to develop as 5G becomes more prevalent and semiconductor usage grows in vehicle safety, entertainment, industrial automation, and autonomous systems.
Market Overview:
Wafer, package substrate, glass, and ceramic dicing are just a few of the many uses for dicing tapes. Due to the simplicity with which chips may be removed from wafers following the dicing process, these are becoming more and more popular among manufacturers of semiconductors.
Manufacturers of dicing tape offer both UV and non-UV tapes. The UV dicing tape has a static layer that removes negative charges and shields the wafers from harm, making it more popular than alternatives. Comparatively speaking, UV-curable dicing tape has a stronger adhesion than non-UV-curable tape. Additionally, UV curable dicing tape prevents impurities from being transmitted to the wafer surface.
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Non-UV Dicing Tapes Market: Segment Assessment
Based By Material Type:
- PVC
- PET
- PO
- Others (EVA, etc)
Based By Thickness:
- 85-125 Micron
- 126-150 Micron
- Below 85 Micron
- Above 150 Micron
Based By Coating Type:
- Single sided
- Double sided
Based By Application:
- Wafer dicing
- Package dicing
- Others (Glass, ceramics)
Major Players Competing:
Pantech Tape Co. Ltd., Mitsui Chemicals Inc., AI Technology, Inc., Furukawa Electric Co. Ltd., LINTEC Corporation, Pantech Tape Co. Ltd, and QES GROUP BERHAD.
COVID-19 Pandemic Impact:
Since the semiconductor industry has been having trouble with raw material availability, even as packaging makers have been operating at breakneck speeds despite the coronavirus pandemic, their business operations have been impacted. Due to a chip shortage in the semiconductor sector, market participants for dicing tapes are using government stimulus measures to stay alive financially. Due to the hazards posed by emerging virus types like Omicron and NeoCoV, it is anticipated that business operations would resume as normal by the end of 2022. Dicing tape import and export are expected to expand as electronic product shipments and demand rise.
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